Cabinet nod for transfer of SSB land to Arunachal
New Delhi, July 4: The Union Cabinet on Wednesday approved the transfer of a 5.99 acre Sashastra Seema Bal (SSB) plot in Tawang to the Arunachal Pradesh government for constructing a multipurpose ground.
Union Home Minister Rajnath Singh announced the decision after a cabinet meeting chaired by Prime Minister Narendra Modi.
The state government had identified land measuring 5.99 acres within the campus of SSB -- a central paramilitary force mandated to guard 1,751 km India-Nepal and 699 km India-Bhutan borders -- at Tawang for the multipurpose ground with parking facility over 4,73 acres and a ring road (1.26 acres), Singh said at a media briefing here.
"Accordingly, they requested for the transfer of the 5.99 acres to the state," the Minister said.
The Ministry of Development of North Eastern Region has already sanctioned the project titled "construction of mega-festival-cum-multipurpose ground with parking facilities and approach road at Tawang, Arunachal Pradesh" in March 2016. The ground will, apart from other events, is proposed to be used for holding tourism festivals.
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India to get first national security semiconductor fabrication plant
Wilmington (PTI): Under a transformative collaboration with the US, India will get a national security semiconductor fabrication plant that will produce chips for use in military hardware and next-generation telecommunications.
The India-US joint project was announced following talks between Prime Minister Narendra Modi and US President Joe Biden in Wilmington on Saturday.
A joint fact sheet on Modi-Biden talks said the two leaders "hailed" the semiconductor project as a "watershed arrangement".
It will be the first ever India-US semiconductor fabrication partnership.
It is the first time ever the US military has agreed to do a partnership for these highly-value technologies with India and it is a watershed moment as it is as significant as the civil nuclear deal, people familiar with the matter said.
"President Biden and Prime Minister Modi hailed a watershed arrangement to establish a new semiconductor fabrication plant focused on advanced sensing, communication, and power electronics for national security, next-generation telecommunications, and green energy applications," the fact sheet noted.
It said the "fab, which will be established with the objective of manufacturing infrared, gallium nitride and silicon carbide semiconductors, will be enabled by support from the India semiconductor mission as well as a strategic technology partnership between Bharat Semi, 3rdiTech, and the US Space Force."
The Fab becomes not only India’s first, but one of the world's first multi-material fabs for national security, the people cited above said.
The fact sheet said Modi and Biden praised combined efforts to facilitate resilient, secure, and sustainable semiconductor supply chains including through GlobalFoundries' (GF) creation of the GF Kolkata Power Center in Kolkata.
It said the project will enhance mutually beneficial linkages in research and development in chip manufacturing.
"The leaders welcomed steps our industry is taking to build safe, secure, and resilient supply chains for US, Indian, and international automotive markets, including through Ford Motor Company's submission of a Letter of Intent to utilize its Chennai plant to manufacture for export to global markets," the document said.
It said Modi and Biden commended ongoing efforts to build more expansive cooperation around 5G deployment and next-generation telecommunications.
This includes the US Agency for International Development's plans to expand the Asia Open RAN Academy with an initial USD 7 million investment to grow this workforce training initiative worldwide, including in South Asia with Indian institutions.
